SEIKO Precision Top > Engineering TOP > MMX-888
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:: MMX-888 ::
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◇X-RAY 2 Spindles Automatic Measuring and Drilling Machine

This machine is capable of detecting more than two guide mark positions, and compensating the difference between the designed mark positions and actual mark positions in X and Y direction to drill the points which have minimum difference from the designed position.

◇ Feature
  • Multi-point Compensating System
    Data input is easily done even if some marks to be drilled at mark-center and some marks to be drilled at compensated positions are mixed at the same board.
  • Auto-unloading Function
  • The board can be unloaded to conveyor after drilling operations.
  • Auto adjustment of spindle distance and table perpendicularity
    Stable accuracy is maintained throughout continuous running by auto adjustment function of spindle distance and table perpendicularity.
  • Movable Clamper
    The clamper which has the same diameter with the drill moves with the drill. This prevents flash from happening.
  • Group input by compensating conditions
    Data input is easily done even if centered drilling positions and compensated drilling positions are mixed at the same board.

◇ Specifications of application Station
Drilling diameterφ6.0mm (max)
Spindle stroke8.0mm (max)
Image processing area10 x 10mm (max)
Work size290 x 310mm(min)
610 x 710mm(max)
Spindle distanceX-Axis 300〜 700mm
Y-Axis〜 600mm
Drilling Accuracy± 20μm(For compensated hole distance)
± 20μm(When drilled at mark center)
± 20μm(When drilled in distance)
Production capacity
(clamp to unclamp)
4 sec/2 hole board
10 sec/4 hole board
17 sec/4 hole board
SpindleAir spindle
(30,000rpm± 10%)
X-RAY Leakage1μSv/H (max)
Powerφ200V 4KVA
Air0.6Mpa, 600Nl/min (Dry air)
Dimensions1600(W) x 2970(D) x 1600(H)mm
Weigh2500kg
 Contact
   Engineering Devices division
  
   Tel: +81-47-470-7165
   fa@seiko-p.co.jp