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Home > Engineering > MP Automatic Dispenser 



Uses
- Application of BGA potting resin
- Application of flip chip undercoat
- COB sealing
- Application of various materials and assembly of various types of objects


Features
- Automatically weighs and corrects the weight of resin and of material to be applied, to achieve high precision coating.

- Achieves accurate, high-precision positional application by automatic calibration of nozzle-tip positioning and image processing when replacing a syringe.

- Copes with diverse demands and small-lot production needs, as the sizes of works to be processed can be adjusted as deemed necessary and with no pre-set restraints.

- Allows you to create, modify, and/or check an application path on a large color LCD touch panel, eliminating the need to acquire specialized knowledge (such as robot language, for example). In the event of a problem, faulty sections are displayed graphically.
 Specifications in Brief
Number of
application stations
2 (single-station specifications also available)
Work size
Maximum   :  320 mm (long) x 150 mm (wide) x 1.6 mm (thick)
Minimum   :  70 mm (long) x 50 mm (wide) x 0.4 mm (thick)
Specifications of
an application station
Application range   :  300 mm x 130 mm
Robot X and Y axes   :  Servo motor
Z axis   :  Cylinder (a servo motor may be used)
Head pitch   :  Variable from 80 to 150 mm

Image processing
Nozzle position correction
Correction of applied resin amount and material measurement
Loader/unloader